Huawei Advances Chip Technology Amid U.S.-China Tensions

Huawei's rotating chairman Eric Xu revealed the company has developed high-bandwidth memory technology, a domain previously dominated by Samsung and SK Hynix. The tech giant plans annual chip releases with doubled computing power, signaling aggressive expansion in semiconductor capabilities.

The announcement coincides with heightened U.S.-China trade tensions, coming days before a scheduled meeting between Presidents TRUMP and Xi Jinping. Huawei disclosed detailed roadmaps for its Ascend AI chips and Kunpeng server processors, with new releases planned through 2028.

China's chip conflict with the U.S. intensified as Nvidia faced antitrust allegations and Chinese firms were instructed to cancel AI chip orders. The moves underscore Beijing's determination to build self-reliance in critical technologies amid escalating trade restrictions.